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d a t a sh eet product speci?cation supersedes data of 1997 apr 22 file under integrated circuits, ic16 1998 apr 03 integrated circuits pca167x series 32 khz watch circuits using a silver-oxide or a 3 v lithium battery
1998 apr 03 2 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series features 32 khz oscillator, amplitude regulated with excellent frequency stability high immunity of the oscillator to leakage currents very low current consumption; typically 150 na stop function for accurate timing chopped motor pulses available power-on reset for fast testing various test modes for testing the mechanical parts of the watch and the ic. general description the pca167x series devices are cmos integrated circuits specially suited for battery-operated, quartz-crystal-controlled wrist-watches, with a bipolar stepping motor. ordering information note 1. figure 1 and chapter package outline show details of standard package, available for large orders only. chapter chip dimensions and bonding pad locations shows exact pad locations for other delivery formats. type number package (1) name description version PCA1672U - chip in tray - pca1673u - chip in tray - pca1675u - chip in tray - pca1676u/10 - chip on foil - pca1677u - chip in tray - pinning symbol pin description v ss 1 ground (0 v) test 2 test output osc in 3 oscillator input osc out 4 oscillator output v dd 5 positive supply voltage m1 6 motor 1 output m2 7 motor 2 output reset 8 reset input fig.1 pin configuration, pca167xt, (pmfp8). 1 2 3 4 8 7 6 5 pca167xt v ss test osc in osc out reset m2 m1 v dd msa978
1998 apr 03 3 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series functional description and testing motor pulse the motor output pulse widths (t p ) and the cycle times (t t ) are given in chapter available types. power-on reset for correct operation of the power-on reset the rise time of v dd from 0 v to 1.55 v should be less than 0.1 ms. all resettable flip-flops are reset. additionally the polarity of the first motor pulse is positive: v m1 - v m2 3 0v. customer testing and stop mode an output frequency of 32 hz is provided at reset (pin 8) to be used for exact frequency measurement. connecting the reset to v dd stops the motor pulses leaving them in a high impedance 3-state condition and a 32 hz signal is produced at the test pin. a debounce circuit protects against accidental stoppages due to mechanical shock to the watch (t deb = 14.7 to 123.2 ms). connecting reset to v ss activates the test mode. the motor pulse period is 31.25 ms instead of t t . test and stop mode are disabled by disconnecting reset (open-circuit). available types refer to fig.2 and to chapters ordering information and functional description and testing. note 1. u = chip in trays; u/10 = chip on foil. short type number delivery format (1) period t t (s) specifications pulse width t p (ms) drive (%) eeprom battery eol detection remarks 1672 u 1 7.8 56 no no 3 v lithium 1673 u 1 5.8 56 no no 3 v lithium 1675 u 1/16 5.8 100 no no no oscillator 1676 u/10 10 5.8 56 no no 3 v lithium 1677 u 10 7.8 100 no no 1.5 v fig.2 motor output waveform (normal operation). msa977 v m1 - m2 2t t t t t p
1998 apr 03 4 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series limiting values in accordance with the absolute maximum rating system (iec 134). note 1. connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows, which will rapidly discharge the battery. handling inputs and outputs are protected against electrostatic discharges in normal handling. however, to be totally safe, it is advisable to take handling precautions appropriate to handling mos devices. advice can be found in data handbook ic16, general, handling mos devices . characteristics v dd = 1.55 v; v ss =0v; f osc = 32.768 khz; t amb =25 c; crystal: r s =20k w ; c 1 = 2 to 3 ff; c l = 8 to 10 pf; c 0 = 1 to 3 pf; unless otherwise speci?ed. symbol parameter conditions min. max. unit v dd supply voltage v ss = 0 v; note 1 - 1.8 +6 v v i all input voltages v ss v dd v output short-circuit duration inde?nite t amb operating ambient temperature - 10 +60 c t stg storage temperature - 30 +100 c symbol parameter conditions min. typ. max. unit supply v dd supply voltage t amb = - 10 to +60 c 1.2 1.5 3.5 v d v dd supply voltage variation transient; v dd = 1.2 to 3.5 v -- 0.25 v i dd1 supply current between motor pulses - 150 250 na i dd2 supply current between motor pulses; v dd = 3.5 v - 200 350 na i dd3 supply current stop mode; pin 8 connected to v dd - 180 300 na i dd4 supply current stop mode; pin 8 connected to v dd ; v dd = 3.5 v - 300 480 na
1998 apr 03 5 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series notes 1. cycle time can be changed to one of the following values: 1, 5, 10, 12 or 20 s (see chapter available types). 2. pulse width can be varied from 2 ms to 15.7 ms in steps of 1 ms (see chapter available types). 3. duty factor i s 1 : 32 and reset = v dd or v ss . motor output v sat saturation voltage s (p + n) r l =2k w ; t amb = - 10 to +60 c - 150 200 mv r sc short-circuit resistance s (p+n) i transistor <1ma - 200 300 w t t cycle time note 1 t p pulse width note 2 oscillator v osc st starting voltage 1.2 -- v g m transconductance v i(p-p) =50mv 6 15 -m s t osc start-up time - 1 - s d f/f frequency stability d v dd = 100 mv - 0.05 10 - 6 0.3 10 - 6 c i input capacitance - 3 - pf c o output capacitance 19 24 29 pf reset input f o output frequency - 32 - hz d v o output voltage swing r = 1 m w ; c=10pf 1.4 -- v t edge edge time r = 1 m w ; c=10pf - 1 -m s i im peak input current note 3 - 320 - na i i(av) average input current - 10 - na test mode t t1 cycle time - 31.25 - ms t deb debounce time reset = v dd 14.7 - 123.2 ms symbol parameter conditions min. typ. max. unit
1998 apr 03 6 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series chip dimensions and bonding pad locations table 1 bonding pad locations (dimensions in m m) all x/y coordinates are referenced to the centre of pad (v dd ), see fig.3. pad x y v ss 1290 1100 test 940 1100 osc in 481 1100 osc out - 102 1100 v dd 00 m1 578 0 m2 930 0 reset 1290 0 chip corner (max. value) - 497.5 - 170 fig.3 bonding pad locations, pca167xu series; 8 terminals. chip area: 2.91 mm 2 . bonding pad dimensions: 110 m m 110 m m. chip thickness: 200 25 m m, with bumps: 270 25 m m. msa979 0 0 1.44 mm v dd m1 m2 reset v ss test osc in osc out y x 2.02 mm pca167xu series
1998 apr 03 7 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series application information fig.4 typical application circuit diagram. (1) quartz crystal case should be connected to v dd . stray capacitance and leakage resistance from reset, m1 or m2 to osc in should be less than 0.5 pf or larger than 20 m w . msa980 v dd m1 m2 reset v ss test osc in osc out m (1) 1.55 v pca167x series 1 2 3 4 8 7 6 5 15 pf c t
1998 apr 03 8 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series package outline unit ce references outline version european projection issue date iec jedec eiaj mm dimensions (mm are the original dimensions) sot144-1 94-01-25 95-01-24 b n max. l m max. h e 0.40 0.25 0.19 0.12 3.1 2.9 3.1 2.9 4.6 4.4 0.80 0.75 0.26 0.3 q 1 q 2 w t 0.40 0.30 0.1 0.40 0.30 0.95 0.90 0.70 l w m b q 2 q 1 0 2.5 5 mm scale note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. e (1) (1) d e t n pin 1 index 4 1 5 8 d e c m x detail x pmfp8: plastic micro flat package; 8 leads (straight) sot144-1 a 2 a 2 h e
1998 apr 03 9 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). re?ow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. wave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. repairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1998 apr 03 10 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1998 apr 03 11 philips semiconductors product speci?cation 32 khz watch circuits using a silver-oxide or a 3 v lithium battery pca167x series notes
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novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 printed in the netherlands 415108/1200/03/pp12 date of release: 1998 apr 03 document order number: 9397 750 03604

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